Published 1990 | Version v1
Book

Crystal nucleation in armorphous Si thin films during ion irradiation

  • 1. Thomas J. Watson Sr. Lab. of Applied Physics, California Inst. of Technology, Pasadena, CA (United States)

Description

This paper reports on the nucleation and transformation kinetics of the amorphous-to-crystal transition in Si films under 1.5 MeV Xe+ irradiation investigated by means of in-situ transmission electron microscopy in the temperature range T = 480 - 580 degrees C. After an incubation period during which negligible nucleation occurs, a constant nucleation rate was observed in steady state, suggesting homogeneous nucleation. A significant enhancement in nucleation rate during high energy ion irradiation (6 order of magnitude) was observed as compared with thermal crystallization, with an apparent activation energy of Qn = 3.9 ± 0.75 eV. Independent analyses of the temperature dependence of the incubation time, the crystal growth rate, and nucleation rate suggest that interface rearrangement kinetics and not the thermodynamic barrier to crystallization are affected by ion irradiation

Additional details

Publishing Information

Publisher
Materials Research Society.
Imprint Place
Pittsburgh, PA (United States)
ISBN
1-55899-076-3
Imprint Title
Thin film structures and phase stability
Imprint Pagination
343 p.
Journal Page Range
p. 113-118.

Conference

Title
Spring meeting of the Materials Research Society (MRS).
Dates
16-21 Apr 1990.
Place
San Francisco, CA (United States).

INIS

Country of Publication
United States
Country of Input or Organization
United States
INIS RN
23007073
Subject category
S36: MATERIALS SCIENCE; S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference
Descriptors DEI
CRYSTAL GROWTH; CRYSTALLIZATION; IRRADIATION; KINETICS; NUCLEATION; SILICON; THERMODYNAMICS; THIN FILMS; TRANSMISSION ELECTRON MICROSCO; XENON
Descriptors DEC
ELECTRON MICROSCOPY; ELEMENTS; FILMS; MICROSCOPY; NONMETALS; PHASE TRANSFORMATIONS; RARE GASES; SEMIMETALS

Optional Information

Secondary number(s)
CONF-900466--.