Voltage oxide removal for plating: A new method of electroplating oxide coated metals in situ

A novel in situ method for electroplating oxide coated metals is described. Termed VORP, for voltage oxide removal for plating, the process utilizes a voltage pulse ∼20-200 V, ∼2 ms in duration, applied between working and counterelectrodes while both are immersed in a copper electrolyte. The pulse is almost immediately followed by galvanostatic plate-up. Adherent copper deposits up to ∼4 μm in height on stainless steel 316 coupons have been obtained. Temperature testing up to 260 deg. C in air does not affect the copper adhesion. A preliminary model for oxide removal is proposed utilizing concepts of dielectric breakdown