Published December 1993 | Version v1
Journal article

Reliability effects of x-ray lithography exposures on submicron-channel MOSFETs

  • 1. Army Research Lab., Adelphi, MD (United States)

Description

Submicron-channel-length n and p-channel MOSFETs subjected to channel hot-carrier stressing were investigated, and the reliability of devices with and without exposure to simulated x-ray lithography processing steps was compared. No significant differences were observed between the sample groups

Additional details

Publishing Information

Journal Title
IEEE Transactions on Nuclear Science
Journal Volume
40
Journal Issue
6Pt1
Journal Page Range
p. 1367-1371.
ISSN
0018-9499
CODEN
IETNAE

Conference

Title
international nuclear and space radiation effects conference.
Acronym
NSREC '93
Dates
19-23 Jul 1993.
Place
Snowbird, UT (United States).

INIS

Country of Publication
United States
Country of Input or Organization
United States
INIS RN
26026409
Subject category
S46: INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY; S42: ENGINEERING;
Resource subtype / Literary indicator
Conference
Descriptors DEI
CHARGE CARRIERS; MASKING; MOSFET; PHYSICAL RADIATION EFFECTS; RELIABILITY; TRAPPING; X RADIATION
Descriptors DEC
ELECTROMAGNETIC RADIATION; FIELD EFFECT TRANSISTORS; IONIZING RADIATIONS; MOS TRANSISTORS; RADIATION EFFECTS; RADIATIONS; SEMICONDUCTOR DEVICES; TRANSISTORS

Optional Information

Secondary number(s)
CONF-930704--.