Published November 2018 | Version v1
Journal article

Characterization of Cu2SnS3 thin films prepared by sulfurization of co-evaporated Cu–SnS precursor layers

  • 1. The Department of Physics, Chung-ang University, 84 Heukseok-ro, Dongjak-gu, Seoul 156-756 (Korea, Republic of)

Description

Highlights: • Cu2SnS3 thin films were fabricated on soda-lime glass substrates. • Surface morphology, optical and electrical properties of the Cu2SnS3 thin films were examined. • Temperature-dependent electrical properties of the thin film were also analyzed. - Abstract: Monoclinic Cu2SnS3 thin films were prepared by sulfurizing Cu–SnS precursor layers deposited by a co-evaporation method on soda-lime glass substrates. The morphological, optical and electrical properties of the Cu2SnS3 thin films were investigated by scanning electron microscopy, spectral transmittance, and Hall effect measurements. All Cu2SnS3 thin films prepared in this study exhibited p-type conductivity and a direct band gap of 0.86–0.87 eV with a high absorption coefficient (α > 104 cm−1). However, carrier concentrations and electrical resistivities varied noticeably, depending on their metallic composition ratios and sulfurization temperatures. The thin film with a metallic composition ratio [Cu]/[Sn] = 1.66 had a carrier concentration, resistivity, and mobility of 3.12 × 1017 cm−3, 6.37 Ω·cm, and 3.14 cm2/V·s, respectively. The temperature dependence of electrical resistivity, carrier concentration, and Hall mobility of this thin film was also obtained from liquid nitrogen temperature to room temperature to examine charge transport properties.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2018.09.035

Additional details

Identifiers

DOI
10.1016/j.tsf.2018.09.035;
PII
S0040609018306345;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
666
Journal Page Range
p. 61-65
ISSN
0040-6090
CODEN
THSFAP

Optional Information

Copyright
Copyright (c) 2017 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.