Published January 15, 1991 | Version v1
Journal article

Properties of the ablation process for excimer laser ablation of Y1Ba2Cu3O7

  • 1. United States Army, Electronics Technology and Devices Laboratory, Fort Monmouth, New Jersey 07703-5000 (USA)
  • 2. Martin Goffman Associates, 3 Dellview Drive, Edison, New Jersey 08820-2545 (USA)
  • 3. Institute for Physical Science and Technology, University of Maryland, College Park, Maryland 20742 (USA)

Description

The process of excimer laser ablation has been studied while varying the laser fluence from 0.237 to 19.1 J/cm2. Ion time-of-flight, total charge, target etch depth per pulse, and etch volume per pulse have been measured. Results indicate a maximum ablation volume and minimum ionization fraction occur near 5 J/cm2. Several of the parameters measured vary rapidly in the 1--5 J/cm2 range. Variation in these parameters strongly influences the properties of films grown by this technique

Additional details

Publishing Information

Journal Title
Journal of Applied Physics
Journal Volume
69
Journal Issue
2
Series
J. Appl. Phys.
Journal Page Range
1107-1109
ISSN
0021-8979
CODEN
JAPIA