Published November 2024 | Version v1
Journal article

Dynamic RON degradation suppression by gate field plate in partially recessed AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors

  • 1. Department of Electrical Engineering and Electronics, University of Liverpool, Liverpool, L69 3GJ (United Kingdom)
  • 2. School of Advanced Technology, Xi'an Jiaotong-Liverpool University, Suzhou, 215123 (China)
  • 3. School of Chips, Entrepreneur College (Taicang), Xi'an Jiaotong-Liverpool University, Suzhou, 215123 (China)

Description

This study investigates the impact of gate field plate (G-FP) lengths on the dynamic on-resistance degradation in partially recessed-gate D-mode GaN metal-insulator-semiconductor high-electron-mobility transistors (MIS-HEMTs). Devices with G-FPs of varying lengths are fabricated, and their electrical characteristics are evaluated. It is found that G-FPs effectively reduce electron trapping and suppress the dynamic on-resistance degradation, leading to improved device performance. The study provides design suggestions for enhancing the reliability and stability of AlGaN/GaN-based MIS-HEMTs. (© 2024 Wiley‐VCH GmbH)

Availability note (English)

Available from: http://dx.doi.org/10.1002/pssa.202300976

Additional details

Identifiers

Publishing Information

Journal Title
Physica Status Solidi. A, Applications and Materials Science (Online)
Journal Volume
221
Journal Issue
21
Journal Page Range
p. 1-5
ISSN
1862-6319
CODEN
PSSABA

Optional Information

Notes
AID: 2300976; Nitride semiconductors