Published September 5, 2015 | Version v1
Journal article

Numerical study on drag reduction and heat transfer enhancement in microchannels with superhydrophobic surfaces for electronic cooling

  • 1. School of Energy Power and Mechanical Engineering, North China Electric Power University, Beijing 102206 (China)
  • 2. School of Engineering and Materials Sciences, Queen Mary University of London, Mile End Road, London E1 4NS (United Kingdom)

Description

Microchannels with superhydrophobic surfaces are a promising candidate for electric cooling with mild frictional penalty. Frictional and thermal performance of laminar liquid-water flow in such microchannels is numerically investigated for various shear-free fractions and Reynolds numbers. The structures on superhydrophobic surfaces include square posts and holes, transverse and longitudinal grooves. Combined frictional and thermal performance of microchannels is evaluated by a goodness factor, and is compared with that of smooth plain channels. It is found that with increasing shear-free fractions, both friction factor and average Nusselt number deteriorate for four surface patterns; however, goodness factor is improved significantly over smooth plain channels. In general, superhydrophobic surfaces containing longitudinal and transverse grooves exhibit the lowest and highest frictional and thermal performance, respectively; however, combined performance of these two are on opposite. Among four surface patterns, longitudinal grooves have the highest goodness factors, except at high shear-free fractions or high Reynolds numbers where overall performance is surpassed by square posts. At very low or high shear-free fractions, frictional and thermal performance of two-dimensional square posts and holes approaches that of one-dimensional longitudinal or transverse grooves. Our study suggests microchannels with superhydrophobic surfaces as promising candidates for efficient cooling devices.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.applthermaleng.2014.10.058

Additional details

Identifiers

DOI
10.1016/j.applthermaleng.2014.10.058;
PII
S1359-4311(14)00929-6;

Publishing Information

Journal Title
Applied Thermal Engineering
Journal Volume
88
Journal Page Range
p. 71-81
ISSN
1359-4311
CODEN
ATENFT

Conference

Title
2014 international heat transfer symposium
Dates
6-9 May 2014
Place
Beijing (China)

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
47019756
Subject category
S42: ENGINEERING;
Resource subtype / Literary indicator
Conference
Descriptors DEI
COMPARATIVE EVALUATIONS; COOLING; DRAG; FRICTION FACTOR; HEAT TRANSFER; HOLES; LIQUIDS; NUMERICAL ANALYSIS; NUSSELT NUMBER; ONE-DIMENSIONAL CALCULATIONS; PERFORMANCE; REDUCTION; SHEAR; SURFACES; TWO-DIMENSIONAL CALCULATIONS; WATER
Descriptors DEC
CHEMICAL REACTIONS; DIMENSIONLESS NUMBERS; ENERGY TRANSFER; EVALUATION; FLUIDS; HYDROGEN COMPOUNDS; MATHEMATICS; OXYGEN COMPOUNDS

Optional Information

Copyright
Copyright (c) 2014 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.