Wirebonding on 2S Modules of the Phase-2 CMS Detector

The LHC will be upgraded to the HL-LHC in the Long Shutdown 3 starting 2024. To fulfill the requirements, the CMS detector will be upgraded in the Phase-2 Upgrade. Among others the silicon tracking system will be completely replaced by a new system providing an extended acceptance, an improved granularity and the feature to include its tracking information into the level-1 trigger. The new Outer Tracker will consist of 2S modules consisting of two strip sensors and PS modules with a macro-pixel sensor and a strip sensor. The electrical connection between the strip sensors and the front-end electronics is realized by thin aluminum wire bonds. In this talk the process of wire bonding is introduced and its implementation in the 2S module series production is discussed. For this, a procedure of parameter optimization is developed and applied on a 2S dummy module.