Published April 15, 2004
| Version v1
Journal article
Internal friction of Ni-Ti and Ni-Ti-Cu plates produced by lamination process
Creators
Description
Ni-Ti and Ni-Ti-Cu alloys were produced by lamination and diffusion processes. The objective of this study is to understand the mechanism of high damping. These alloys undergo phase transformations. When cooling, elastic modulus decreases and internal friction increases at the transformation temperature, and in the martensite region elastic modulus shows the minimum and a relaxation peak or an increase of background damping is observed depending on conditions. Those behaviors are closely related with dislocation motion at twin interface or slip plane in martensite. It has been proposed that the phase stability, modulus drop and damping capacity due to dislocations are categorized by two electronic parameters B-bar0 and Md-bar
Additional details
Identifiers
- DOI
- 10.1016/j.msea.2003.08.101;
- PII
- S0921509303008700;
Publishing Information
- Journal Title
- Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing
- Journal Volume
- 370
- Journal Issue
- 1-2
- Journal Page Range
- p. 560-563
- ISSN
- 0921-5093
- CODEN
- MSAPE3
Conference
- Title
- 13. international conference on internal friction and ultrasonic attenuation in solids
- Dates
- 8-12 Jul 2002
- Place
- Bilbao (Spain)
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 38073483
- Subject category
- S36: MATERIALS SCIENCE;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- COOLING; COPPER; DAMPING; DISLOCATIONS; INTERNAL FRICTION; MARTENSITE; NICKEL; PHASE STABILITY; PHASE TRANSFORMATIONS; PLATES; RELAXATION; SLIP; TITANIUM
- Descriptors DEC
- ALLOYS; CARBON ADDITIONS; CRYSTAL DEFECTS; CRYSTAL STRUCTURE; ELEMENTS; FRICTION; IRON ALLOYS; LINE DEFECTS; METALS; STABILITY; TRANSITION ELEMENT ALLOYS; TRANSITION ELEMENTS
Optional Information
- Copyright
- Copyright (c) 2003 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.