Published September 15, 2008 | Version v1
Journal article

Effect of phase assemblage of precursor on the fabrication process and properties of Bi2223 tape sheathed with Ag-alloy

  • 1. Toyohashi University of Technology, 1-1 Tempaku-cho, Toyohashi, Aichi 441-8580 (Japan)

Description

The use of alloy sheath is effective to increase the strength of Ag-sheathed Bi2223 tapes. However, the Jc value of alloy sheathed tapes was not high enough since the undesired reaction to form impurity phases and the change in formation rate of Bi2223 were disturbed by the microstructure of the filaments . In this study, the effect of 2223 contents in precursor on the formation and property of Bi2223 tapes sheathed with Ag-Mg alloy was investigated. The conversion rate of Bi2223 from Bi2212 was increased by the addition of Bi2223 phase in precursor but the conversion rate in Ag-Mg alloy sheathed tapes was slower than that in the Ag-Cu alloy sheathed tapes. This reduction of conversion speed of Bi2223 may be attributed to the decrease in the growth rate of Bi2223 crystals in Ag-Mg alloy sheath. Since the tapes with small Bi2223 crystals after first sintering showed many outgrowths after final sintering, the formation of outgrowth would be caused in the case of small crystal size. The Jc value of 2.2 x 104 A/cm2 was achieved in the samples using the precursor with 10 wt.% 2223. The high Jc value can be achieved by the proper control of precursor condition including the contents of Bi2223 and corresponding heat treatment pattern in Ag-Mg alloy sheathed tapes

Availability note (English)

Available from http://dx.doi.org/10.1016/j.physc.2008.05.189

Additional details

Identifiers

DOI
10.1016/j.physc.2008.05.189;
PII
S0921-4534(08)00361-4;

Publishing Information

Journal Title
Physica. C, Superconductivity
Journal Volume
468
Journal Issue
15-20
Journal Page Range
p. 1760-1763
ISSN
0921-4534
CODEN
PHYCE6

Conference

Title
20. international symposium on superconductivity
Acronym
ISS 2007
Dates
5-7 Nov 2007
Place
Tsukuba (Japan)

Optional Information

Copyright
Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.