Published March 2021
| Version v1
Journal article
Deformation-induced ultrafine grains near fatigue crack tip and correlative fatigue damage in Al matrix composite
Creators
- 1. State Key Laboratory of Metal Matrix Composites, Shanghai Jiao Tong University, Shanghai 200240 (China)
- 2. Anhui Province Engineering Research Center of Aluminium Matrix Composites, Huaibei 235000 (China)
Description
New insight into the microstructural evolution and the correlative damage mechanisms near fatigue crack tip in a TiB2/Al composite was conducted by transmission kikuchi diffraction and transmission electron microscopy. It was found that the micro deformation band formed from the crack tip and ran along slip planes. Ultrafine grains were induced in deformation band, where the fatigue crack preferring to grow along these deformation-induced boundaries was first demonstrated as the essential process of crack across parent grains and grain boundaries. Ahead of crack tip, the TiB2 particles can affect crack growth by impeding the successive propagation of deformation band.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.scriptamat.2020.10.040Additional details
Identifiers
- DOI
- 10.1016/j.scriptamat.2020.10.040;
- PII
- S1359646220306990;
Publishing Information
- Journal Title
- Scripta Materialia
- Journal Volume
- 193
- Journal Page Range
- p. 49-54
- ISSN
- 1359-6462
- CODEN
- SCMAF7
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 53120219
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- CRACK PROPAGATION; CRACKS; DEFORMATION; DIFFRACTION; FATIGUE; GRAIN BOUNDARIES; SLIP; TITANIUM BORIDES; TRANSMISSION ELECTRON MICROSCOPY
- Descriptors DEC
- BORIDES; BORON COMPOUNDS; COHERENT SCATTERING; ELECTRON MICROSCOPY; MECHANICAL PROPERTIES; MICROSCOPY; MICROSTRUCTURE; SCATTERING; TITANIUM COMPOUNDS; TRANSITION ELEMENT COMPOUNDS
Optional Information
- Copyright
- Copyright (c) 2020 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.