Published October 29, 2010 | Version v1
Journal article

Aluminum-induced crystallization of amorphous silicon films deposited by hot wire chemical vapor deposition on glass substrates

  • 1. EM Photonics, Inc., 51 E. Main St., Newark, DE 19711 (United States)
  • 2. GE Ceramic Composite Products, LLC., 400 Bellevue Rd. Newark DE 19713 (United States)
  • 3. Institute of Energy Conversion, 451 Wyoming Road, University of Delaware, Newark, DE 19716 (United States)

Description

Aluminum-induced crystallization of amorphous silicon films is discussed. Amorphous Si films were deposited by hot wire chemical vapor deposition onto Al coated glass substrates at 430 oC. Complete crystallization of a-Si films was achieved during a-Si deposition by controlling Al and Si layer thicknesses. The grain structure of the poly-Si films formed on glass substrate was evaluated by optical and electron microscopy. Continuous poly-Si films were obtained using Al layers with a thickness of 500 nm or less. The average grain size was found to be 10-15 μm, corresponding to a grain size/thickness ratio greater than 20.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2010.07.097

Additional details

Identifiers

DOI
10.1016/j.tsf.2010.07.097;
PII
S0040-6090(10)01056-4;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
519
Journal Issue
1
Journal Page Range
p. 178-183
ISSN
0040-6090
CODEN
THSFAP

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
42067200
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
ALUMINIUM; CHEMICAL VAPOR DEPOSITION; CRYSTALLIZATION; GLASS; GRAIN SIZE; LAYERS; SILICON; TEMPERATURE RANGE 0400-1000 K; THIN FILMS
Descriptors DEC
CHEMICAL COATING; DEPOSITION; ELEMENTS; FILMS; METALS; MICROSTRUCTURE; PHASE TRANSFORMATIONS; SEMIMETALS; SIZE; SURFACE COATING; TEMPERATURE RANGE

Optional Information

Copyright
Copyright (c) 2010 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.