Published January 1, 2005 | Version v1
Journal article

Charging characteristics of Si nanocrystals embedded within SiO2 in the presence of near-interface oxide traps

  • 1. Institute of Microelectronics, NCSR 'Demokritos', PO Box 60228, 15310 Aghia Paraskevi (Greece)

Description

In this work we report on the influence of oxide traps-located near the Si substratetunnel oxide interface - on the charging characteristics of Si-nanocrystals embedded within SiO2 layers, by monitoring the admittance characteristics at room temperature. We study this effect in the case of Si-nanocrystals fabricated by LPCVD deposition of α-Si and high temperature thermal oxidation. In the samples investigated in this work, oxide hole traps located almost at the Si-SiO2 interface of the silicon substrate were found to control hole injection and transfer to the Si nanocrystals. Upon capturing a hole the defect energy levels undergo a transition due to lattice relaxation effects and hole charging of the Si-nanocrystals occurs via an inelastic two-step tunneling mechanism. High temperature annealing was found to reduce the density of these near-interfacial defects, therefore reducing the coupling between the Si-nanocrystals and the substrate

Availability note (English)

Available online at http://stacks.iop.org/1742-6596/10/39/jpconf5_10_010.pdf or at the Web site for the Journal of Physics. Conference Series (Online) (ISSN 1742-6596) http://www.iop.org/

Additional details

Publishing Information

Journal Title
Journal of Physics. Conference Series (Online)
Journal Volume
10
Journal Issue
1
Journal Page Range
p. 39-42
ISSN
1742-6596

Conference

Title
2. conference on microelectronics, microsystems and nanotechnology
Dates
14-17 Nov 2004
Place
Athens (Greece)

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
36108026
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference
Descriptors DEI
ANNEALING; BEAM INJECTION; CRYSTAL DEFECTS; DEPOSITION; ENERGY LEVELS; INTERFACES; NANOSTRUCTURES; OXIDATION; RELAXATION; SILICON; SILICON OXIDES; SUBSTRATES; TEMPERATURE RANGE 0273-0400 K; TRAPS; TUNNEL EFFECT
Descriptors DEC
CHALCOGENIDES; CHEMICAL REACTIONS; CRYSTAL STRUCTURE; ELEMENTS; HEAT TREATMENTS; OXIDES; OXYGEN COMPOUNDS; SEMIMETALS; SILICON COMPOUNDS; TEMPERATURE RANGE