Published March 11, 2015 | Version v1
Journal article

Strengthening of an Al–Cu–Mg alloy processed by high-pressure torsion due to clusters, defects and defect–cluster complexes

  • 1. Engineering Materials, Faculty of Engineering and the Environment, University of Southampton, SO17 1BJ (United Kingdom)
  • 2. Herbert Gleiter Institute of Nanoscience, Nanjing University of Science and Technology, Nanjing 210094 (China)
  • 3. Australian Centre for Microscopy & Microanalysis, The University of Sydney, Madsen Building F09, NSW 2006 (Australia)

Description

A physically-based model is established to predict the strength of cluster strengthened ultrafine-grained ternary alloys processed by severe plastic deformation. The model incorporates strengthening due to dislocations, grain refinement, co-clusters (due to short range order and modulus strengthening) and solute segregation. The model is applied to predict strengthening in an Al–Cu–Mg alloy processed by high-pressure torsion (HPT). The microstructure was investigated using transmission electron microscopy (TEM), atom probe tomography (APT), and X-ray diffraction (XRD). Analysis of XRD line profile broadening shows that the dislocation density increases significantly due to severe plastic deformation, which contributes to the increase of strength. APT reveals the presence of nanoscale co-clusters and defect-solute clustering. The concepts of the multiple local interaction energies between solutes and dislocations were used to quantitatively explain the strengthening mechanisms. The model shows a good correspondence with measured microstructure data and measured strength

Availability note (English)

Available from http://dx.doi.org/10.1016/j.msea.2014.12.107

Additional details

Identifiers

DOI
10.1016/j.msea.2014.12.107;
PII
S0921-5093(14)01618-9;

Publishing Information

Journal Title
Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing
Journal Volume
627
Journal Page Range
p. 10-20
ISSN
0921-5093
CODEN
MSAPE3

Optional Information

Copyright
Copyright (c) 2015 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.