Published October 2012
| Version v1
Journal article
Geant4 simulation of contribution of nuclear reaction to single event upset
- 1. Institute of Microelectronics, Chinese Academy of Sciences, Beijing (China)
Description
Single event upset (SEU) effect in semiconductor devices and integrated circuits (IC) was simulated using Geant4. General structure and simulation method were established to study SEU effect accurately. Ionization and nuclear reaction mechanisms were used to generate statistical profiles of charge deposition in sensitive volume of semiconductor devices and ICs. The results showed that the device structure with a tungsten layer above the sensitive volume could be more likely to cause an SEU. (authors)
Additional details
Publishing Information
- Journal Title
- Nuclear Techniques
- Journal Volume
- 35
- Journal Issue
- 10
- Journal Page Range
- p. 765-770
- ISSN
- 0253-3219
INIS
- Country of Publication
- China
- Country of Input or Organization
- China
- INIS RN
- 47057271
- Subject category
- S46: INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY;
- Descriptors DEI
- CROSS SECTIONS; DEPOSITION; EQUIPMENT; INTEGRATED CIRCUITS; LAYERS; NUCLEAR REACTIONS; PHYSICAL RADIATION EFFECTS; SEMICONDUCTOR DEVICES; SIMULATION; TUNGSTEN
- Descriptors DEC
- ELECTRONIC CIRCUITS; ELEMENTS; METALS; MICROELECTRONIC CIRCUITS; RADIATION EFFECTS; REFRACTORY METALS; TRANSITION ELEMENTS
Optional Information
- Notes
- 6 figs., 16 refs.