Published October 1, 2000
| Version v1
Journal article
Au-Ni-Sn intermetallic phase relationships in eutectic Pb-Sn solder formed on Ni/Au metallization
Description
no abstract available
Additional details
Publishing Information
- Journal Title
- Journal of Electronic Materials
- Journal Volume
- 30
- Journal Issue
- 4
- Journal Page Range
- [10 p.]
- ISSN
- 0361-5235
- CODEN
- JECMA5
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 33060523
- Subject category
- S36: MATERIALS SCIENCE;
- Resource subtype / Literary indicator
- No Abstract
- Descriptors DEI
- EUTECTICS; GOLD ALLOYS; INTERMETALLIC COMPOUNDS; LEAD ALLOYS; METALLURGICAL FLUX; NICKEL ALLOYS; PHASE STUDIES; SOLDERING; TIN ALLOYS
- Descriptors DEC
- ALLOYS; FABRICATION; JOINING; TRANSITION ELEMENT ALLOYS; WELDING
Optional Information
- Contract/Grant/Project number
- AC03-76SF00098
- Notes
- Journal Publication Date: Apr. 2001
- Funding organization
- USDOE Director, Office of Science. Office of Basic Energy Studies. Division of Materials Sciences (United States)
- Secondary number(s)
- LBNL--46739