Published July 1, 2019 | Version v1
Journal article

The CV characteristics of the Cu2WSe4/p-Si heterojunction depending on wide range temperature

  • 1. Igdir University, Department of Electrical Electronic Engineering, Engineering Faculty (Turkey)
  • 2. Selcuk University, Department of Physics, Faculty of Science (Turkey)
  • 3. Karamanoğlu Mehmetbey University, Department of Metallurgical Science and Materials Engineering, Faculty of Engineering (Turkey)
  • 4. Selcuk University, Department of Biotechnology, Faculty of Science (Turkey)

Description

Cu2WSe4 nanosheets were synthesized by hot-injection method and employed as interfacial layers between the p-Si and Au metal via spin coating technique. The capacitance–voltage (CV) and conductance-voltage (GV) measurements were performed on the Cu2WSe4/p-Si heterojunction device depending on wide range temperatures from 80 to 400 K by 40 K steps. The device exhibited decreasing capacitance behavior with increasing temperature at the inversion region because of the interface states and series resistance. The conductance values increased with increasing temperature owing to increasing free charge carriers. The series resistance (Rs) and interface states density (Nss) were extracted from CV and GV measurements and discussed in the details. The results highlighted that the electrical parameters are a strong function of the voltage and temperature. The Au/Cu2WSe4/p-Si device can be employed for controllable capacitor applications.

Additional details

Identifiers

Publishing Information

Journal Title
Journal of Materials Science. Materials in Electronics
Journal Volume
30
Journal Issue
13
Journal Page Range
p. 11994-12000
ISSN
0957-4522
CODEN
JSMEEV

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
52018859
Subject category
S77: NANOSCIENCE AND NANOTECHNOLOGY; S36: MATERIALS SCIENCE;
Descriptors DEI
CHARGE CARRIERS; ELECTRIC POTENTIAL; HETEROJUNCTIONS; SPIN-ON COATING
Descriptors DEC
DEPOSITION; SEMICONDUCTOR JUNCTIONS; SURFACE COATING

Optional Information

Copyright
Copyright (c) 2019 Springer Science+Business Media, LLC, part of Springer Nature