The C–V characteristics of the Cu2WSe4/p-Si heterojunction depending on wide range temperature
- 1. Igdir University, Department of Electrical Electronic Engineering, Engineering Faculty (Turkey)
- 2. Selcuk University, Department of Physics, Faculty of Science (Turkey)
- 3. Karamanoğlu Mehmetbey University, Department of Metallurgical Science and Materials Engineering, Faculty of Engineering (Turkey)
- 4. Selcuk University, Department of Biotechnology, Faculty of Science (Turkey)
Description
Cu2WSe4 nanosheets were synthesized by hot-injection method and employed as interfacial layers between the p-Si and Au metal via spin coating technique. The capacitance–voltage (C–V) and conductance-voltage (G–V) measurements were performed on the Cu2WSe4/p-Si heterojunction device depending on wide range temperatures from 80 to 400 K by 40 K steps. The device exhibited decreasing capacitance behavior with increasing temperature at the inversion region because of the interface states and series resistance. The conductance values increased with increasing temperature owing to increasing free charge carriers. The series resistance (Rs) and interface states density (Nss) were extracted from C–V and G–V measurements and discussed in the details. The results highlighted that the electrical parameters are a strong function of the voltage and temperature. The Au/Cu2WSe4/p-Si device can be employed for controllable capacitor applications.
Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of Materials Science. Materials in Electronics
- Journal Volume
- 30
- Journal Issue
- 13
- Journal Page Range
- p. 11994-12000
- ISSN
- 0957-4522
- CODEN
- JSMEEV
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 52018859
- Subject category
- S77: NANOSCIENCE AND NANOTECHNOLOGY; S36: MATERIALS SCIENCE;
- Descriptors DEI
- CHARGE CARRIERS; ELECTRIC POTENTIAL; HETEROJUNCTIONS; SPIN-ON COATING
- Descriptors DEC
- DEPOSITION; SEMICONDUCTOR JUNCTIONS; SURFACE COATING
Optional Information
- Copyright
- Copyright (c) 2019 Springer Science+Business Media, LLC, part of Springer Nature