Published September 15, 2011 | Version v1
Journal article

Effect of oxygen gas pressure on the kinetics of alumina film growth during the oxidation of Al(111) at room temperature

  • 1. Center for Functional Nanomaterials, Brookhaven National Laboratory, Upton, New York 11973 (United States)
  • 2. Department of Mechanical Engineering and Multidisciplinary Program in Materials Science and Engineering, State University of New York, Binghamton, New York 13902 (United States)

Description

We have studied the effect of oxygen pressure on the self-limiting oxidation of an Al(111) surface at room temperature for oxygen pressures from 1x10-8 to 5 Torr. Using x-ray photoelectron spectroscopy measurements, we monitor the oxidation kinetics and the oxide film thickness for different oxidation times and pressures. After a rapid initial growth stage, the oxide film reaches a saturated thickness, which depends on the oxygen pressure. The kinetic potential, oxide growth rate, oxide film limiting thickness, and the density of oxygen anions on the oxide surface are determined by the measured oxidation kinetics. These quantities show a Langmuir isotherm dependence on the oxygen gas pressure.

Additional details

Identifiers

Publishing Information

Journal Title
Physical Review. B, Condensed Matter and Materials Physics
Journal Volume
84
Journal Issue
12
Journal Page Range
p. 125445-125445.6
ISSN
1098-0121

Optional Information

Notes
(c) 2011 American Institute of Physics