Growth behavior of electroless Ni-Co-P deposits on Fe

The electroless Ni-Co-P films were deposited on Fe film in plating baths using sodium hypophosphite as reducing agent and nickel and cobalt sulphates as ion source at pH value of 9 and plating temperature from 60 to 85 deg. C. The effect of the mol ratio of CoSO4/CoSO4 + NiSO4 in plating bath on the growth behavior of electroless Ni-Co-P films was studied. The electroless Ni-Co-P films were characterized by transmission electron microscopy for the microstructure and thickness, and energy dispersive spectrometer for the composition. The results showed that the electroless Ni-Co-P films can be deposited on Fe films without the step of sensitization and activization; the surface of electroless Ni-Co-P film on Fe is quite even; the more the Co2+ ion in plating bath, the larger the activation energy and the smaller the plating rate of electroless Ni-Co-P films; and the mol ratio of Co/Co + Ni in film is larger than that in plating bath (with the exception of the film deposited in the bath with 0.9 mol ratio of CoSO4/CoSO4 + NiSO4)