Published October 2012 | Version v1
Journal article

High-density oxidized porous silicon

  • 1. Institut des Nanotechnologies de Lyon (INL)—UMR5270 CNRS, INSA de Lyon, Université de Lyon, 7 Avenue Jean Capelle Villeurbanne F-69621 (France)
  • 2. Institut des Nanotechnologies de Lyon (INL)—UMR5270 CNRS, Université Lyon 1, Université de Lyon, 7 Avenue Jean Capelle Villeurbanne F-69621 (France)
  • 3. STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles Cedex (France)

Description

We have studied oxidized porous silicon (OPS) properties using Fourier transform infraRed (FTIR) spectroscopy and capacitance–voltage C–V measurements. We report the first experimental determination of the optimum porosity allowing the elaboration of high-density OPS insulators. This is an important contribution to the research of thick integrated electrical insulators on porous silicon based on an optimized process ensuring dielectric quality (complete oxidation) and mechanical and chemical reliability (no residual pores or silicon crystallites). Through the measurement of the refractive indexes of the porous silicon (PS) layer before and after oxidation, one can determine the structural composition of the OPS material in silicon, air and silica. We have experimentally demonstrated that a porosity approaching 56% of the as-prepared PS layer is required to ensure a complete oxidation of PS without residual silicon crystallites and with minimum porosity. The effective dielectric constant values of OPS materials determined from capacitance–voltage C–V measurements are discussed and compared to FTIR results predictions. (paper)

Availability note (English)

Available from http://dx.doi.org/10.1088/0268-1242/27/10/105017

Additional details

Publishing Information

Journal Title
Semiconductor Science and Technology
Journal Volume
27
Journal Issue
10
Journal Page Range
[5 p.]
ISSN
0268-1242
CODEN
SSTEET