Non-contact thickness gauging of a thin film using surface waves and a void effect on their propagation
- 1. Département d'Opto-Acousto-Electronique (UMR CNRS 8520), Institut d'Electronique de Microélectronique et de Nanotechnologie, Université de Valenciennes et du Hainaut-Cambrésis, Le Mont-Houy, 59313 Valenciennes cedex 9 (France)
Description
In the first part of this paper, laser ultrasonics has been performed in an original way to evaluate the thickness of a gold thin film deposited on a silicon substrate. To this end, the influence of the film thickness and the elastic parameters of both materials on the first Rayleigh mode propagation has been theoretically studied. Then, using simultaneously the head wave and the Rayleigh wave propagating on the substrate, its elastic parameters were determined. These parameters allowed us to deduce the film thickness by matching the experimental group velocity dispersion curve with the theoretical one in a frequency range up to 25 MHz. In the second part, the effect of a void, consisting of a circular area without layer, on the first Rayleigh mode propagation has been investigated. The experimental results show clearly time of flight shifts proportionally to the size of the area and depending on the considered frequency component. A good agreement was obtained with finite-element modeling. This effect could be the basis for a frequency-selective surface acoustic lens. (paper)
Availability note (English)
Available from http://dx.doi.org/10.1088/0957-0233/23/8/085608Additional details
Identifiers
Publishing Information
- Journal Title
- Measurement Science and Technology
- Journal Volume
- 23
- Journal Issue
- 8
- Journal Page Range
- [8 p.]
- ISSN
- 0957-0233
- CODEN
- MSTCEP
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 46016046
- Subject category
- S46: INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY;
- Descriptors DEI
- GOLD; LASERS; LAYERS; LENSES; MHZ RANGE; RAYLEIGH WAVES; SILICON; SUBSTRATES; THICKNESS; THICKNESS GAGES; THIN FILMS; TIME-OF-FLIGHT METHOD; ULTRASONIC WAVES; WAVE PROPAGATION
- Descriptors DEC
- DIMENSIONS; ELEMENTS; FILMS; FREQUENCY RANGE; MEASURING INSTRUMENTS; METALS; SEMIMETALS; SOUND WAVES; TRANSITION ELEMENTS