Published August 2012 | Version v1
Journal article

Non-contact thickness gauging of a thin film using surface waves and a void effect on their propagation

  • 1. Département d'Opto-Acousto-Electronique (UMR CNRS 8520), Institut d'Electronique de Microélectronique et de Nanotechnologie, Université de Valenciennes et du Hainaut-Cambrésis, Le Mont-Houy, 59313 Valenciennes cedex 9 (France)

Description

In the first part of this paper, laser ultrasonics has been performed in an original way to evaluate the thickness of a gold thin film deposited on a silicon substrate. To this end, the influence of the film thickness and the elastic parameters of both materials on the first Rayleigh mode propagation has been theoretically studied. Then, using simultaneously the head wave and the Rayleigh wave propagating on the substrate, its elastic parameters were determined. These parameters allowed us to deduce the film thickness by matching the experimental group velocity dispersion curve with the theoretical one in a frequency range up to 25 MHz. In the second part, the effect of a void, consisting of a circular area without layer, on the first Rayleigh mode propagation has been investigated. The experimental results show clearly time of flight shifts proportionally to the size of the area and depending on the considered frequency component. A good agreement was obtained with finite-element modeling. This effect could be the basis for a frequency-selective surface acoustic lens. (paper)

Availability note (English)

Available from http://dx.doi.org/10.1088/0957-0233/23/8/085608

Additional details

Publishing Information

Journal Title
Measurement Science and Technology
Journal Volume
23
Journal Issue
8
Journal Page Range
[8 p.]
ISSN
0957-0233
CODEN
MSTCEP

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
46016046
Subject category
S46: INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY;
Descriptors DEI
GOLD; LASERS; LAYERS; LENSES; MHZ RANGE; RAYLEIGH WAVES; SILICON; SUBSTRATES; THICKNESS; THICKNESS GAGES; THIN FILMS; TIME-OF-FLIGHT METHOD; ULTRASONIC WAVES; WAVE PROPAGATION
Descriptors DEC
DIMENSIONS; ELEMENTS; FILMS; FREQUENCY RANGE; MEASURING INSTRUMENTS; METALS; SEMIMETALS; SOUND WAVES; TRANSITION ELEMENTS