Published May 5, 2009 | Version v1
Journal article

Effect of pulse plating and additive on phase separation in Cu-Co nano-granular alloys

  • 1. Materials Processing Division, Bhabha Atomic Research Centre, Mumbai 40085 (India)
  • 2. Department of Metallurgical Engineering and Materials Science, National Institute of Technology, Rourkela, Orissa 769008 (India)
  • 3. Technical Physics and Prototype Engineering Division, Bhabha Atomic Research Centre, Mumbai 40085 (India)
  • 4. Materials Science Division, Bhabha Atomic Research Centre, Mumbai 40085 (India)

Description

Pulse electrolysis was employed to deposit heterogeneous Cu-Co alloys from complexed sulphate-citrate electrolyte. The crystal structure, surface morphology and microstructure of the deposited alloys were analysed to understand the effect of process parameters on the deposit. X-ray and selected area electron diffraction (SAED) studies showed that as-deposited films were composed of two phases, a solid solution of face centred cubic Cu-Co phase and a hexagonal close packed Co phase. Pulse electrolysis and addition of saccharine within the electrolyte were found to enhance in forming two-phase structure. Surface morphology of the pulse current (PC) plated alloys was found to be smoother than their direct current (DC) counterparts. Presence of saccharine within the electrolyte led to further improvement in brightness of the deposits top layer. Microstructural investigations revealed that the deposited alloys were nanocrystalline in nature. Further refinement in grain size and increased homogeneity in microstructure were observed in the presence of saccharine.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.jallcom.2008.07.137

Additional details

Identifiers

DOI
10.1016/j.jallcom.2008.07.137;
PII
S0925-8388(08)01260-7;

Publishing Information

Journal Title
Journal of Alloys and Compounds
Journal Volume
475
Journal Issue
1-2
Journal Page Range
p. 676-682
ISSN
0925-8388
CODEN
JALCEU

Optional Information

Copyright
Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.