Published July 2019 | Version v1
Journal article

Determination of local residual stress in an air plasma spray thermal barrier coating (APS-TBC) by microscale ring coring using a picosecond laser

  • 1. Henry Moseley X-ray Imaging Facility, The Henry Royce Institute, School of Materials, The University of Manchester, Manchester, M13 9PL (United Kingdom)
  • 2. School of Materials, The University of Manchester, Manchester, M13 9PL (United Kingdom)
  • 3. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001 (China)
  • 4. Production Technology Centre, University West, Trollhättan (Sweden)

Description

A picosecond laser for incremental annular trench cutting is combined with digital image correlation (DIC) to extend the incremental ring-core method to the profiling of residual stress in thick (>100 μm) coatings. In this case the local residual stress in a TBC is depth profiled after exposure to 1150 °C for 190 h. The topcoat was found to be in compression with an average compressive stress of −94 ± 8 MPa which is representative of the stresses that would be generated elastically on cooling from a stress-free temperature of ~970 °C. The stress profile measurements have been validated by high-energy synchrotron X-ray diffraction measurements.

Additional details

Identifiers

DOI
10.1016/j.scriptamat.2019.03.036;
PII
S1359646219301794;

Publishing Information

Journal Title
Scripta Materialia
Journal Volume
167
Journal Page Range
p. 126-130
ISSN
1359-6462
CODEN
SCMAF7

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
55043295
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
COATINGS; CUTTING; LASERS; PLASMA; RESIDUAL STRESSES; SYNCHROTRONS; THERMAL BARRIERS; X-RAY DIFFRACTION
Descriptors DEC
ACCELERATORS; COHERENT SCATTERING; CYCLIC ACCELERATORS; DIFFRACTION; MACHINING; SCATTERING; STRESSES

Optional Information

Copyright
Copyright (c) 2019 Published by Elsevier Ltd on behalf of Acta Materialia Inc.