Published July 2019
| Version v1
Journal article
Determination of local residual stress in an air plasma spray thermal barrier coating (APS-TBC) by microscale ring coring using a picosecond laser
- 1. Henry Moseley X-ray Imaging Facility, The Henry Royce Institute, School of Materials, The University of Manchester, Manchester, M13 9PL (United Kingdom)
- 2. School of Materials, The University of Manchester, Manchester, M13 9PL (United Kingdom)
- 3. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001 (China)
- 4. Production Technology Centre, University West, Trollhättan (Sweden)
Description
A picosecond laser for incremental annular trench cutting is combined with digital image correlation (DIC) to extend the incremental ring-core method to the profiling of residual stress in thick (>100 μm) coatings. In this case the local residual stress in a TBC is depth profiled after exposure to 1150 °C for 190 h. The topcoat was found to be in compression with an average compressive stress of −94 ± 8 MPa which is representative of the stresses that would be generated elastically on cooling from a stress-free temperature of ~970 °C. The stress profile measurements have been validated by high-energy synchrotron X-ray diffraction measurements.
Additional details
Identifiers
- DOI
- 10.1016/j.scriptamat.2019.03.036;
- PII
- S1359646219301794;
Publishing Information
- Journal Title
- Scripta Materialia
- Journal Volume
- 167
- Journal Page Range
- p. 126-130
- ISSN
- 1359-6462
- CODEN
- SCMAF7
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 55043295
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- COATINGS; CUTTING; LASERS; PLASMA; RESIDUAL STRESSES; SYNCHROTRONS; THERMAL BARRIERS; X-RAY DIFFRACTION
- Descriptors DEC
- ACCELERATORS; COHERENT SCATTERING; CYCLIC ACCELERATORS; DIFFRACTION; MACHINING; SCATTERING; STRESSES
Optional Information
- Copyright
- Copyright (c) 2019 Published by Elsevier Ltd on behalf of Acta Materialia Inc.