Published March 2018 | Version v1
Journal article

Adhesive-deformation relationships and mechanical properties of nc-AlCrN/a-SiNx hard coatings deposited at different bias voltages

  • 1. Institute of Materials Science, Faculty of Materials Science and Technology, Slovak University of Technology in Bratislava, Jána Bottu 25, 917 24 Trnava (Slovakia)
  • 2. Department of Physics, Chemistry and Biology (IFM), Linköping University, SE-581 83 Linköping (Sweden)
  • 3. Institute of Production Technologies, Faculty of Materials Science and Technology, Slovak University of Technology in Bratislava, Jána Bottu 25, 917 24 Trnava (Slovakia)

Description

Highlights: • Excellent adhesion was observed at low bias voltages. • AlCrSiN coatings exhibit 002-texture evolution with increase in the bias voltage. • Nanocolumnar AlCrN grains and continuous amorphous SiNx matrix are observed. • Stress-induced cracking was found at large bias voltages. • Hardness enhancement due to grain size reduction. - Abstract: A series of Al-Cr-Si-N hard coatings were deposited on WC-Co substrates with a negative substrate bias voltage ranging from −50 to −200 V using cathodic arc evaporation system. A Rockwell-C adhesion test demonstrated that excellent adhesion was observed at lower bias voltages of −50 V and −80 V, while further increases in bias voltage up to −200 V led to severe delamination and worsening of the overall adhesion strength. X-ray diffraction and transmission electron microscopy analysis revealed a single phase cubic B1-structure identified as an AlCrN solid solution with a nanocomposite microstructure where cubic AlCrN nanocrystals were embedded in a thin continuous amorphous SiNx matrix. Coatings exhibited a 002-texture evolution that was more pronounced at higher bias voltages (≥−120 V). Stress-induced cracks were observed inside the coatings at high bias voltages (≥−150 V), which resulted in stress relaxation and a decline in the overall residual stresses.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2018.02.006

Additional details

Identifiers

DOI
10.1016/j.tsf.2018.02.006;
PII
S0040609018300853;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
650
Journal Page Range
p. 11-19
ISSN
0040-6090
CODEN
THSFAP

Optional Information

Copyright
Copyright (c) 2017 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.