Adhesive-deformation relationships and mechanical properties of nc-AlCrN/a-SiNx hard coatings deposited at different bias voltages
Creators
- 1. Institute of Materials Science, Faculty of Materials Science and Technology, Slovak University of Technology in Bratislava, Jána Bottu 25, 917 24 Trnava (Slovakia)
- 2. Department of Physics, Chemistry and Biology (IFM), Linköping University, SE-581 83 Linköping (Sweden)
- 3. Institute of Production Technologies, Faculty of Materials Science and Technology, Slovak University of Technology in Bratislava, Jána Bottu 25, 917 24 Trnava (Slovakia)
Description
Highlights: • Excellent adhesion was observed at low bias voltages. • AlCrSiN coatings exhibit 002-texture evolution with increase in the bias voltage. • Nanocolumnar AlCrN grains and continuous amorphous SiNx matrix are observed. • Stress-induced cracking was found at large bias voltages. • Hardness enhancement due to grain size reduction. - Abstract: A series of Al-Cr-Si-N hard coatings were deposited on WC-Co substrates with a negative substrate bias voltage ranging from −50 to −200 V using cathodic arc evaporation system. A Rockwell-C adhesion test demonstrated that excellent adhesion was observed at lower bias voltages of −50 V and −80 V, while further increases in bias voltage up to −200 V led to severe delamination and worsening of the overall adhesion strength. X-ray diffraction and transmission electron microscopy analysis revealed a single phase cubic B1-structure identified as an AlCrN solid solution with a nanocomposite microstructure where cubic AlCrN nanocrystals were embedded in a thin continuous amorphous SiNx matrix. Coatings exhibited a 002-texture evolution that was more pronounced at higher bias voltages (≥−120 V). Stress-induced cracks were observed inside the coatings at high bias voltages (≥−150 V), which resulted in stress relaxation and a decline in the overall residual stresses.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.tsf.2018.02.006Additional details
Identifiers
- DOI
- 10.1016/j.tsf.2018.02.006;
- PII
- S0040609018300853;
Publishing Information
- Journal Title
- Thin Solid Films
- Journal Volume
- 650
- Journal Page Range
- p. 11-19
- ISSN
- 0040-6090
- CODEN
- THSFAP
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 50035397
- Subject category
- S77: NANOSCIENCE AND NANOTECHNOLOGY;
- Descriptors DEI
- ALUMINIUM COMPOUNDS; AMORPHOUS STATE; CHROMIUM COMPOUNDS; CRACKS; DEFORMATION; HARDNESS; NANOCOMPOSITES; NANOSTRUCTURES; NITROGEN COMPOUNDS; RESIDUAL STRESSES; SILICON NITRIDES; SOLID SOLUTIONS; STRESS RELAXATION; SUBSTRATES; TRANSMISSION ELECTRON MICROSCOPY; TUNGSTEN CARBIDES; X-RAY DIFFRACTION
- Descriptors DEC
- CARBIDES; CARBON COMPOUNDS; COHERENT SCATTERING; DIFFRACTION; DISPERSIONS; ELECTRON MICROSCOPY; HOMOGENEOUS MIXTURES; MATERIALS; MECHANICAL PROPERTIES; MICROSCOPY; MIXTURES; NANOMATERIALS; NITRIDES; NITROGEN COMPOUNDS; PNICTIDES; REFRACTORY METAL COMPOUNDS; RELAXATION; SCATTERING; SILICON COMPOUNDS; SOLUTIONS; STRESSES; TRANSITION ELEMENT COMPOUNDS; TUNGSTEN COMPOUNDS
Optional Information
- Copyright
- Copyright (c) 2017 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.