Microscopic Mechanism of the High-Temperature Strength Behaviour of a C/SiC Composite
Creators
- 1. Beihang University, School of Aeronautical Science and Engineering (China)
- 2. Chinese Academy of Space Technology(Xi'an) (China)
Description
In this paper, a high-temperature test experimental system is built to investigate the dependence of the strength of a C/SiC composite material on temperature. Unintuitively, the strength increases with temperature. To investigate the microscopic mechanism, scanning electron microscopy (SEM) of an in situ bending test experiment is performed. Our hypothesis is that due to significant residual tensile stress in inter-fibre matrix, external loads reach the ultimate stress first. As the temperature increases, the matrix residual tensile stress decreases, a larger external load needs to be applied for matrix failure, which is exhibited macroscopically as increased strength. To prove this hypothesis, the inter-fibre matrix residual stress and its dependence on temperature are calculated via a finite element method. Next, using a SiC wrapper layer around a single C fibre as an experiment object, the finite element calculation is verified directly via micro-Raman spectroscopy.
Additional details
Identifiers
Publishing Information
- Journal Title
- Applied Composite Materials
- Journal Volume
- 26
- Journal Issue
- 3
- Journal Page Range
- p. 1059-1071
- ISSN
- 0929-189X
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 54073674
- Subject category
- S36: MATERIALS SCIENCE; S46: INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY;
- Descriptors DEI
- COMPOSITE MATERIALS; FIBERS; FINITE ELEMENT METHOD; MATRICES; RAMAN SPECTROSCOPY; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDES
- Descriptors DEC
- CALCULATION METHODS; CARBIDES; CARBON COMPOUNDS; ELECTRON MICROSCOPY; LASER SPECTROSCOPY; MATERIALS; MATHEMATICAL SOLUTIONS; MICROSCOPY; NUMERICAL SOLUTION; SILICON COMPOUNDS; SPECTROSCOPY; STRESSES
Optional Information
- Copyright
- Copyright (c) 2019 Springer Nature B.V.