A semi-fixed abrasive machining technique

This paper proposes the technique of semi-fixed abrasive machining to reduce or eliminate the surface defects caused by large abrasive grains and improve the efficiency of ultra-precision processing. The method of semi-fixed abrasive machining is described, and a semi-fixed abrasive plate (SFAP) is manufactured. Under the condition of adding or not adding large grains, experiments of semi-fixed and loose abrasive machining for a workpiece of damage-free single crystal silicon are carried out. The surface roughness and SEM micrograph of the workpieces demonstrate that semi-fixed abrasive machining leads to less surface defects, and the existence of large grains has a slight effect on the surface roughness of the workpiece. Single crystal silicon workpieces with a roughness (Ra) of about 0.2 µm are semi-fixed abrasive processed, in order to investigate the influence of load and rotating speed of the SFAP on the surface roughness and material removal rate. No significant variation of the surface roughness is observed when the value of the load or SFAP rotating speed changes, and the material removal rate increases with the increase of the load or SFAP rotating speed, i.e. the machining efficiency can be improved by increasing the load or SFAP rotating speed while the surface quality of the workpiece does not decrease