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Published September 2021 | Version v1
Journal article

Multiphase field modeling of grain boundary migration mediated by emergent disconnections

  • 1. Division of Engineering and Applied Science, California Institute of Technology, Pasadena, CA (United States)
  • 2. Department of Mechanical and Aerospace Engineering, University of Colorado, Colorado Springs, CO (United States)

Description

Knowledge about grain boundary migration is a prerequisite for understanding and ultimately modulating the properties of polycrystalline materials. Evidence from experiments and molecular dynamics (MD) simulations suggests that the formation and motion of disconnections is a mechanism for grain boundary migration. Here, grain boundary migration is modeled using a multiphase field model based on the principle of minimum dissipation potential with nonconvex boundary energy, along with a stochastic model for thermal nucleation of disconnection pairs. In this model, disconnections arise spontaneously in the presence of an elastic driving force, and that their motion mediates boundary migration. The effect is due to the fact that the formation of the disconnections pairs results in a stress concentration, causing the elastic driving force to exceed the threshold value and driving the propagation of the disconnection along the interface. The model is applied to study the propagation/annihilation of single disconnection pairs, the relaxation of a perturbed interface, and shear coupling at various temperatures. The results are consistent with the current understanding of disconnections, and capture the effect of thermal softening.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.actamat.2021.117149

Additional details

Identifiers

DOI
10.1016/j.actamat.2021.117149;
PII
S1359645421005292;

Publishing Information

Journal Title
Acta Materialia
Journal Volume
217
Journal Page Range
vp.
ISSN
1359-6454
CODEN
ACMAFD

Optional Information

Copyright
Copyright (c) 2021 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.