Published April 20, 2006 | Version v1
Journal article

Various applications of silicon nitride by catalytic chemical vapor deposition for coating, passivation and insulating films

  • 1. Japan Advanced Institute of Science and Technology, Asahidai, Nomi, Ishikawa 923-1292 (Japan)

Description

Various applications of silicon nitride (SiN x) films prepared by catalytic chemical vapor deposition (Cat-CVD) as coating, passivation and insulating films are reviewed. Characteristic features of SiN x films by Cat-CVD are dense (low hydrogen content), low wet-etch rate, low oxygen or water-vapor transmission rate even when prepared at low temperatures below 300 deg. C and low stress. Therefore, SiN x films prepared by Cat-CVD are suitable as coating and passivation films for electronic devices, mechanical parts and plastic films. SiN x films prepared by Cat-CVD are, of course, also applicable as insulating films used in ultralarge-scale integrated circuits (ULSIs) and thin-film transistors (TFTs). These various applications are introduced, along with a summary of the fundamental properties of the SiN x films and a possible explanation as to why such dense films are obtained even at low temperatures

Additional details

Identifiers

DOI
10.1016/j.tsf.2005.07.172;
PII
S0040-6090(05)01039-4;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
501
Journal Issue
1-2
Journal Page Range
p. 149-153
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
3. international conference on hot-wire CVD (Cat-CVD) process
Dates
23-27 Aug 2004
Place
Utrecht (Netherlands)

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
37115121
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference
Descriptors DEI
CHEMICAL VAPOR DEPOSITION; COATINGS; INTEGRATED CIRCUITS; PASSIVATION; SILICON NITRIDES; STRESSES; THIN FILMS; WATER VAPOR
Descriptors DEC
CHEMICAL COATING; DEPOSITION; ELECTRONIC CIRCUITS; FILMS; FLUIDS; GASES; MICROELECTRONIC CIRCUITS; NITRIDES; NITROGEN COMPOUNDS; PNICTIDES; SILICON COMPOUNDS; SURFACE COATING; VAPORS

Optional Information

Copyright
Copyright (c) 2005 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.