Published November 1999 | Version v1
Journal article

Bond strength, bond stress and spallation mechanisms of thermal barrier coatings

  • 1. Connecticut Univ., Storrs, CT (United States). Dept. of Metall. and Mater. Eng.
  • 2. Connecticut Univ., Storrs, CT (United States). Dept. of Mechanical Engineering

Description

Five production thermal barrier coatings were thermally cycled between room temperature and 1121 C (2050 F) to determine relative spallation life. Bond strength measurements were made using a modified ASTM direct pull-test. Bond stress measurements were made in the thermally grown oxide using a laser photoluminescence technique. Bond strength and bond stress measurements were conducted on two electron beam physical vapor deposition coatings as a function of thermal cycling. Each coating showed characteristic values of as-coated strength and stress and changes in strength and stress with thermal cycling. These variations in strength and stress with thermal cycling are related to oxidation and micro-debonding effects. (orig.)

Additional details

Publishing Information

Journal Title
Surface and Coatings Technology
Journal Volume
120-121
Journal Page Range
p. 53-60
ISSN
0257-8972
CODEN
SCTEEJ

Conference

Title
26. international conference on metallurgical coatings and thin films, and exhibit
Acronym
ICMCTF '99
Dates
12-16 Apr 1999
Place
San Diego, CA (United States)

Optional Information

Notes
18 refs.