Published February 2014
| Version v1
Journal article
Utilizing the phonon glass electron crystal concept to improve the thermoelectric properties of combined Yb-stuffed and Te-substituted CoSb3
Creators
- 1. School of Engineering and Material Science, Queen Mary University of London, London E1 4NS (United Kingdom)
- 2. State Key Laboratory of Material Processing and Die and Mould Technology, Huazhong University of Science and Technology, Wuhan 430074 (China)
- 3. European Thermodynamics Limited, Leicester LE8 0RX (United Kingdom)
- 4. Nanoforce Technology Limited, London E1 4NS (United Kingdom)
Description
A cost-effective and rapid mechanical alloying method was used to prepare Yb-stuffed and Te-substituted CoSb3 to study the thermoelectric properties of this material. Yb rattles inside the cage-like structure of CoSb3 which effectively reduces the phonon mean free path and results in a lattice thermal conductivity comparable to those of costly nanostructured CoSb3 materials. A very low lattice thermal conductivity of 1.17 W m−1 K−1 at ∼550 K was obtained. A zT value of ∼0.7 was reported at 600 K due to the very low lattice thermal conductivity
Availability note (English)
Available from http://dx.doi.org/10.1016/j.scriptamat.2013.10.021Additional details
Identifiers
- DOI
- 10.1016/j.scriptamat.2013.10.021;
- PII
- S1359-6462(13)00553-8;
Publishing Information
- Journal Title
- Scripta Materialia
- Journal Volume
- 72-73
- Journal Page Range
- p. 63-66
- ISSN
- 1359-6462
- CODEN
- SCMAF7
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 46027956
- Subject category
- S36: MATERIALS SCIENCE; S77: NANOSCIENCE AND NANOTECHNOLOGY;
- Descriptors DEI
- CRYSTALS; NANOSTRUCTURES; RARE EARTHS; THERMAL CONDUCTIVITY; THERMOELECTRIC MATERIALS; THERMOELECTRIC PROPERTIES
- Descriptors DEC
- ELECTRICAL PROPERTIES; ELEMENTS; MATERIALS; METALS; PHYSICAL PROPERTIES; THERMODYNAMIC PROPERTIES
Optional Information
- Copyright
- Copyright (c) 2013 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.