Published 1991
| Version v1
Book
Thermal spike model of ion-induced grain growth
Creators
- 1. Argonne National Lab., IL (United States). Materials Science and Technology Div.
- 2. Michigan Univ., Ann Arbor, MI (United States). Dept. of Nuclear Engineering
Description
This paper reports on a thermal spike model developed to describe the phenomenon of ion irradiation-induced grain growth in metal alloy thin films. In single phase films where the driving force for grain growth is the reduction of grain boundary curvature, the model shows that ion-induced grain boundary mobility, Mion, is proportional to the quantity FD2/Δcoh3, where FD is the ion and recoil energy deposited in nuclear interactions and ΔHcoh is the cohesive energy of the element or alloy. Experimental grain growth results from ion irradiated coevaporated binary alloy films compare favorably with model predictions
Additional details
Publishing Information
- Publisher
- Materials Research Society.
- Imprint Place
- Pittsburgh, PA (United States)
- ISBN
- 1-55899-094-1
- Imprint Title
- Evolution of thin-film and surface microstructure
- Imprint Pagination
- 731 p.
- Journal Page Range
- p. 205-210.
Conference
- Title
- Fall meeting of the Materials Research Society (MRS).
- Dates
- 24 Nov - 1 Dec 1990.
- Place
- Boston, MA (United States).
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 23041875
- Subject category
- S36: MATERIALS SCIENCE; S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- BINARY ALLOY SYSTEMS; GRAIN BOUNDARIES; ION BEAMS; ION IMPLANTATION; IRRADIATION; PHASE DIAGRAMS; PHYSICAL RADIATION EFFECTS; THIN FILMS
- Descriptors DEC
- ALLOY SYSTEMS; BEAMS; CRYSTAL STRUCTURE; DIAGRAMS; FILMS; INFORMATION; MICROSTRUCTURE; RADIATION EFFECTS
Optional Information
- Funding organization
- National Science Foundation, Washington, DC (United States).
- Secondary number(s)
- CONF-901105--.