Published 2001 | Version v1
Miscellaneous Metadata-only

Nondestructive strength evaluation of adhesive-bonded single-lap joints by signal processing method

Creators

  • 1. Soongsil Univ., Seoul (Korea, Republic of)
  • 2. Korea Institute of Science and Technology Information, Taejon (Korea, Republic of)

Description

Application of bonding by adhesives can be found in many industries, particularly in advanced technological domains such as the aeronautical and space industries, automobile manufacture, and electronics. Periodic inspection with conventional ultrasonic NDE techniques is capable of indicating the presence and possible location of crack. Continuous ultrasonic attenuation monitoring has potential to supply information. This study used adhesive-bonded single-lap joints specimen to evaluate such possibility by ultrasonic signal processing method

Part of:
Proceedings of the KSME 2001 spring annual meeting A

Additional details

Publishing Information

Publisher
KSME
Imprint Place
Seoul (Korea, Republic of)
Imprint Title
Proceedings of the KSME 2001 spring annual meeting A
Imprint Pagination
980 p.
Journal Page Range
p. 541-546

Conference

Title
KSME 2001 spring annual meeting A
Dates
27-29 Jun 2001
Place
Cheju (Korea, Republic of)

INIS

Country of Publication
Korea, Republic of
Country of Input or Organization
Korea, Republic of
INIS RN
36017209
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference, Non-conventional Literature
Descriptors DEI
ADHESIVES; BONDING; CRACKS; FOURIER ANALYSIS; JOINTS; MECHANICAL PROPERTIES; NONDESTRUCTIVE ANALYSIS; PULSE ANALYZERS; ULTRASONIC WAVES
Descriptors DEC
CHEMICAL ANALYSIS; ELECTRONIC EQUIPMENT; EQUIPMENT; FABRICATION; JOINING; SOUND WAVES

Optional Information

Notes
9 refs, 7 figs, 1 tab