Published February 1, 2010 | Version v1
Journal article

TEM analysis of Ge-on-Si MOSFET structures with HfO2 dielectric for high performance PMOS device technology

  • 1. Department of Electronic and Electrical Engineering, University of Sheffield, Sir Frederick Mappin Building, Mappin Street, Sheffield, S1 3JD (United Kingdom)
  • 2. Department of Physics, University of Warwick, Coventry, CV4 7AL (United Kingdom)
  • 3. IMEC, Kapeldreef 75, B-3001 Leuven (Belgium)
  • 4. Department of Electronics and Electrical Engineering, Rankine Building, Oakfield Avenue, Glasgow, G12 8LT (United Kingdom)

Description

In this paper, we present a (scanning) transmission electron microscopy analysis of novel Ge-on-Si MOSFETs which incorporate a high-k HfO2 dielectric and TaN/TiN metal gate electrodes. A key feature of these devices is the incorporation of a very thin (∼1nm) Si passivation layer on top of the Ge virtual substrate, which is partially oxided to form SiO2 (∼0.5nm), before depositing the HfO2 dielectric and TaN and TiN metal gate electrodes. Our results confirm the architecture of the device structures and the existence of Si passivation.

Availability note (English)

Available from http://dx.doi.org/10.1088/1742-6596/209/1/012061

Additional details

Publishing Information

Journal Title
Journal of Physics. Conference Series (Online)
Journal Volume
209
Journal Issue
1
Journal Page Range
[4 p.]
ISSN
1742-6596

Conference

Title
16. international conference on microscopy of semiconducting materials
Dates
17-20 Mar 2009
Place
Oxford (United Kingdom)