Published March 1, 2010 | Version v1
Journal article

AES, LEED and PYS investigation of Au deposits on InSe/Si(1 1 1) substrate

  • 1. Faculte des Sciences, Departement de Physique, Universite Djillali Liabes, Sidi Bel-Abbes 22000 (Algeria)
  • 2. ENSET d'Oran, BP 1523 Oran Mnaouar, Oran (Algeria)
  • 3. Laboratoire de microscopie electronique USTO, departement de physique, BP1505 El m'naouar, Oran (Algeria)
  • 4. Laboratoire de physique de la matiere condensee et nanostructures, laboratoire des multimateriaux et interfaces, Universite Claude Bernard Lyon I, 43 Bd du 11 novembre 1918, Villeurbanne 69622 (France)

Description

Auger Electron Spectroscopy (AES), Low Energy Electron Diffraction (LEED) and Photoelectron Yield Spectroscopy (PYS) measurements have been used to monitor the interaction of gold (Au) deposits on InSe/Si(1 1 1) substrate. Au has been sequentially deposed under ultra-high vacuum onto 40 A-thick film of layered semiconductor InSe which is epitaxially grown by molecular beam epitaxy (MBE) on a Si(1 1 1)1 x 1-H substrate and kept at room temperature. Au coverage varies from 0.5 monolayer to 20 monolayers (ML) (in terms of InSe atomic surface plane: 1 ML = 7.2 1014 at/cm2) which is corresponding to 1.30 A of Au-metal. The Au/InSe/Si(1 1 1) system was characterized as function of Au deposit, we noticed an interaction at room temperature starts as an apparent intercalation process until 5 ML. Beyond this dose Au islands begin to form on the sample surface without interaction with InSe substrate, thus the interface is far from to be a simple junction Au-InSe.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.apsusc.2009.11.021

Additional details

Identifiers

DOI
10.1016/j.apsusc.2009.11.021;
PII
S0169-4332(09)01610-9;

Publishing Information

Journal Title
Applied Surface Science
Journal Volume
256
Journal Issue
10
Journal Page Range
p. 3007-3009
ISSN
0169-4332
CODEN
ASUSEE

Optional Information

Copyright
Copyright (c) 2009 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.