Characterization of elastic interactions in GaAs/Si composites by optically pumped nuclear magnetic resonance
Creators
- 1. Department of Chemistry, University of Florida, Gainesville, Florida 32611 (United States)
- 2. Department of Physics, University of Florida, Gainesville, Florida 32611 (United States)
Description
Elastic interactions in GaAs/Si bilayer composite structures were studied by optically pumped nuclear magnetic resonance (OPNMR). The composites were fabricated by epoxy bonding of a single crystal of GaAs to a single crystal of Si at 373 K followed by selective chemical etching of the GaAs at room temperature to obtain a series of samples with GaAs thickness varying from 37 μm to 635 μm, while the Si support thickness remained fixed at 650 μm. Upon cooling to below 10 K, a biaxial tensile stress developed in the GaAs film due to differential thermal contraction. The strain perpendicular to the plane of the bilayer and localized near the surface of the GaAs was deduced from the quadrupolar splitting of the Gallium-71 OPNMR resonance. Strain relaxation by bowing of the composite was observed to an extent that depended on the relative thickness of the GaAs and Si layers. The variation of the strain with GaAs layer thickness was found to be in good agreement with a general analytical model for the elastic relationships in composite media.
Additional details
Identifiers
- DOI
- 10.1063/1.4961427;
Publishing Information
- Journal Title
- Journal of Applied Physics
- Journal Volume
- 120
- Journal Issue
- 8
- Journal Page Range
- vp.
- ISSN
- 0021-8979
- CODEN
- JAPIAU
INIS
- Country of Publication
- United States
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 48043526
- Subject category
- S71: CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- BONDING; BOWING; COOLING; EPOXIDES; ETCHING; FILMS; GALLIUM 71; GALLIUM ARSENIDES; INTERACTIONS; LAYERS; MONOCRYSTALS; NUCLEAR MAGNETIC RESONANCE; RELAXATION; SILICON; STRAINS; STRESSES; SURFACES; TEMPERATURE RANGE 0273-0400 K; THICKNESS
- Descriptors DEC
- ARSENIC COMPOUNDS; ARSENIDES; CRYSTALS; DEFORMATION; DIMENSIONS; ELEMENTS; FABRICATION; GALLIUM COMPOUNDS; GALLIUM ISOTOPES; INTERMEDIATE MASS NUCLEI; ISOTOPES; JOINING; MAGNETIC RESONANCE; NUCLEI; ODD-EVEN NUCLEI; ORGANIC COMPOUNDS; ORGANIC OXYGEN COMPOUNDS; PNICTIDES; RESONANCE; SEMIMETALS; STABLE ISOTOPES; SURFACE FINISHING; TEMPERATURE RANGE
Optional Information
- Notes
- (c) 2016 Author(s)