Evaluation of interfacial properties in SiC composites using an improved cohesive element method
- 1. Xi'an Jiaotong University, School of Nuclear Science and Technology (China)
Description
A two-dimensional axisymmetric finite element model based on an improved cohesive element method was developed to simulate interfacial debonding, sliding friction, and residual thermal stresses in SiC composites during single-fiber push-out tests to extract the interfacial bond strength and frictional stress. The numerical load–displacement curves agree well with experimental curves, indicating that this cohesive element method can be used for calculating the interfacial properties of SiC composites. The simulation results show that cracks are most likely to occur at the ends of the experimental sample, where the maximum shear stress is observed and that the interfacial shear strength and constant sliding friction stress decrease with an increase in temperature. Moreover, the load required to cause complete interfacial failure increases with the increase in critical shear strength, and the composite materials with higher fiber volume fractions have higher bearing capacities. In addition, the initial failure load increases with an increase in interphase thickness.
Additional details
Identifiers
Publishing Information
- Journal Title
- Nuclear Science and Techniques
- Journal Volume
- 29
- Journal Issue
- 2
- Journal Page Range
- p. 1-9
- ISSN
- 1001-8042
- CODEN
- NSETEC
INIS
- Country of Publication
- China
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 50018382
- Subject category
- S36: MATERIALS SCIENCE; S97: MATHEMATICAL METHODS AND COMPUTING;
- Descriptors DEI
- AXIAL SYMMETRY; COMPOSITE MATERIALS; CRACKS; DIAGRAMS; FAILURES; FINITE ELEMENT METHOD; SHEAR; SHEAR PROPERTIES; SILICON CARBIDES; SLIDING FRICTION; THERMAL STRESSES; TWO-DIMENSIONAL CALCULATIONS
- Descriptors DEC
- CALCULATION METHODS; CARBIDES; CARBON COMPOUNDS; FRICTION; INFORMATION; MATERIALS; MATHEMATICAL SOLUTIONS; MECHANICAL PROPERTIES; NUMERICAL SOLUTION; SILICON COMPOUNDS; STRESSES; SYMMETRY
Optional Information
- Copyright
- Copyright (c) 2018 Shanghai Institute of Applied Physics, Chinese Academy of Sciences, Chinese Nuclear Society, Science Press China and Springer Nature Singapore Pte Ltd.