Relationship between dislocation structure characteristics at triple junction and grain orientation in high pure copper

Highlights: • The dislocation structure at TJs of high pure copper is observed and analyzed by TEM. • The dislocation density at TJs increases with the deformation. • The dislocation density in soft grain is larger than that in hard one. • The dislocation is determined to be (1/2) perfect dislocation. The dislocation structure at triple junctions with small to medium deformation in the samples of high pure copper is observed and analyzed by TEM. The effects of deformation and grain orientation on the dislocation structure at triple junctions are characterized. The results show that the dislocation density increases with the deformation. The dislocation lines are introduced in the slightly cold rolled copper while the dislocation networks are formed as the deformation increases. The dislocation density in soft grain is larger than that in hard one at the same deformation. The dislocation is determined to be (1/2) 011 perfect dislocation.