Compositionally graded SiCu thin film anode by magnetron sputtering for lithium ion battery
- 1. Department of Metallurgical and Materials Engineering, Istanbul Technical University, Maslak, Istanbul 34469 (Turkey)
- 2. Energy Systems Division, Argonne National Laboratory, Argonne, IL 60439 (United States)
- 3. Chemical Sciences and Engineering Division, Argonne National Laboratory, Argonne, IL 60439 (United States)
Description
Compositionally graded and non-graded composite SiCu thin films were deposited by magnetron sputtering technique on Cu disks for investigation of their potentials in lithium ion battery applications. The compositionally graded thin film electrodes with 30 at.% Cu delivered a 1400 mAh g−1 capacity with 80% Coulombic efficiency in the first cycle and still retained its capacity at around 600 mAh g−1 (with 99.9% Coulombic efficiency) even after 100 cycles. On the other hand, the non-graded thin film electrodes with 30 at.% Cu exhibited 1100 mAh g−1 as the first discharge capacity with 78% Coulombic efficiency but the cycle life of this film degraded very quickly, delivering only 250 mAh g−1 capacity after 100th cycles. Not only the Cu content but also the graded film thickness were believed to be the main contributors to the much superior performance of the compositionally graded SiCu films. We also believe that the Cu-rich region of the graded film helped reduce internal stress build-up and thus prevented film delamination during cycling. In particular, the decrease of Cu content from interface region to the top of the coating reduced the possibility of stress build-up across the film during cycling, thus leading to a high electrochemical performance.b - Highlights: • Highly adherent SiCu films are deposited by magnetron sputtering. • Compositionally graded SiCu film is produced and characterized. • Decrease of Cu content diverted the propagation of stress in the anode. • Cu rich layer at the bottom improves the adherence of the film.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.tsf.2015.09.085Additional details
Identifiers
- DOI
- 10.1016/j.tsf.2015.09.085;
- PII
- S0040-6090(15)01037-8;
Publishing Information
- Journal Title
- Thin Solid Films
- Journal Volume
- 596
- Journal Page Range
- p. 190-197
- ISSN
- 0040-6090
- CODEN
- THSFAP
Conference
- Title
- 42. international conference on metallurgical coatings and thin films
- Acronym
- ICMCTF 2015
- Dates
- 20-24 Apr 2015
- Place
- San Diego, CA (United States)
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 48020701
- Subject category
- S36: MATERIALS SCIENCE;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ANODES; COPPER; EFFICIENCY; ELECTROCHEMISTRY; INTERFACES; INTERMETALLIC COMPOUNDS; LAYERS; LITHIUM ION BATTERIES; POTENTIALS; RESIDUAL STRESSES; SILICON; SPUTTERING; THIN FILMS
- Descriptors DEC
- ALLOYS; CHEMISTRY; ELECTRIC BATTERIES; ELECTROCHEMICAL CELLS; ELECTRODES; ELEMENTS; ENERGY STORAGE SYSTEMS; ENERGY SYSTEMS; FILMS; METALS; SEMIMETALS; STRESSES; TRANSITION ELEMENTS
Optional Information
- Copyright
- Copyright (c) 2015 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.