Published June 30, 2008 | Version v1
Journal article

Structural and mechanical properties of titanium and titanium diboride monolayers and Ti/TiB2 multilayers

  • 1. Department of Manufacturing Engineering and Engineering Management (MEEM), City University of Hong Kong, Kowloon (Hong Kong)

Description

Nano-multilayers represent a new class of engineering materials that are made up of alternating nanometer scale layers of two different components. In the present work a titanium (Ti) monolayer was combined with titanium diboride (TiB2) to form a Ti/TiB2 nano-multilayer. Designed experimental parameters enabled an evaluation of the effects of direct current bias voltage (Ub) and bilayer thickness (Λ) during multilayer deposition on the mechanical properties of reactively sputtered Ti/TiB2 multilayer films. Their nanostructures and mechanical properties were characterized and analyzed using X-ray photoelectron spectroscopy (XPS), low-angle and high-angle X-ray diffraction (XRD), plan-view and cross-sectional high-resolution transmission electron microscopy (HRTEM), and microindentation measurements. Under the optimal bias voltage of Ub = - 60 V, it was found that Λ (varied from 1.1 to 9.8 nm) was the most important factor which dominated the nanostructure and hardness. The hardness values obtained varied from 12 GPa for Ti and 15 GPa for TiB2 monolayers, up to 33 GPa for the hardest Ti/TiB2 multilayer at Λ = 1.9 nm. The observed hardness enhancement correlated to the layer thickness, followed a relation similar to the Hall-Petch strengthening dependence, with a generalized power of ∼ 0.6. In addition, the structural barriers between two materials (hcp Ti/amorphous TiB2) and stress relaxation at interfaces within multilayer films resulted in a reduction of crack propagation and high-hardness

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2007.07.042

Additional details

Identifiers

DOI
10.1016/j.tsf.2007.07.042;
PII
S0040-6090(07)01145-5;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
516
Journal Issue
16
Journal Page Range
p. 5313-5317
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
International conference on technological advances of thin films and surface coatings
Acronym
Thin films 2006
Dates
11-15 Dec 2006
Place
Singapore (Singapore)

Optional Information

Copyright
Copyright (c) 2007 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.