Published April 16, 2012 | Version v1
Journal article

CaCu3Ti4O12 thin films on conductive oxide electrode: A comparative study between chemical and physical vapor deposition routes

  • 1. Dipartimento di Scienze Chimiche, Università di Catania, and INSTM, UdR Catania, Viale A. Doria 6, 95125 Catania (Italy)
  • 2. Istituto per la Microelettronica e Microsistemi, IMM-CNR, Strada VIII 5, 95121 Catania (Italy)
  • 3. Istituto per lo Studio dei Materiali Nanostrutturati, ISMN-CNR, Via dei Taurini, 19, 00185 Roma (Italy)
  • 4. STMicroelectronics, R and D, Rue Pierre et Marie Curie, 37000 Tours (France)
  • 5. Laboratoire LEMA, UMR 6157 CNRS/CEA, Université F. Rabelais, Parc de Grandmont, 37200 Tours (France)

Description

Highlights: ► Dielectrics growth and characterization is one of the most hot topics of materials science and microelectronics. ► CaCu3Ti4O12 perovskite, recently, demonstrated to possess peculiar dielectric properties (Science, 2001, 293, 673–676). ► To date no deep discussion on the growth processes, properties and perspective of CCTO thin films has been proposed. ► Our paper is an effective example of interdisciplinarity, since the comparison between PLD and MOCVD has been addressed. ► Great attention has been paid to CaCu3Ti4O12 film/substrate interfaces since dielectric properties are strongly affected. - Abstract: Metal Organic Chemical Vapor Deposition (MOCVD) and Pulsed Laser Deposition (PLD) techniques have been used for the growth of CaCu3Ti4O12 (CCTO) thin films on La0.9Sr1.1NiO4/LaAlO3 (LSNO/LAO) stack. (1 0 0) oriented CCTO films have been formed through both deposition routes and film complete structural and morphological characterizations have been carried out using several techniques (X-ray diffraction, scanning electron microscopy, energy-filtered transmission electron microscopy). The comparative study demonstrated some differences at the CCTO/LSNO interfaces depending on the adopted deposition technique. Chemical/structural modification of the LSNO electrode probably occurred as a function of the different oxygen partial pressure used in the PLD and MOCVD processes.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.matchemphys.2012.02.024

Additional details

Identifiers

DOI
10.1016/j.matchemphys.2012.02.024;
PII
S0254-0584(12)00180-0;

Publishing Information

Journal Title
Materials Chemistry and Physics
Journal Volume
133
Journal Issue
2-3
Journal Page Range
p. 1108-1115
ISSN
0254-0584
CODEN
MCHPDR

Optional Information

Copyright
Copyright (c) 2012 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.