Emergence of high quality sputtered III-nitride semiconductors and devices
- 1. Department of Electrical and Computer Engineering, Virginia Commonwealth University, Richmond, 23284 (United States)
- 2. Institute of Industrial Science, The University of Tokyo, Meguro, Tokyo 153-8505 (Japan)
Description
This article provides an overview of recent development of sputtering method for high-quality III-nitride semiconductor materials and devices. Being a mature deposition technique widely employed in semiconductor industry, sputtering offers many advantages such as low cost, relatively simple equipment, non-toxic raw materials, low process temperatures, high deposition rates, sharp interfaces, and possibility of deposition on large-size substrates, including amorphous and flexible varieties. This review covers two major research directions: (1) ex situ sputtered AlN buffers to be used for subsequent growth of GaN-based structures by conventional techniques, such as metal-organic chemical vapor deposition (MOCVD), hydride vapor phase epitaxy (HVPE), or molecular beam epitaxy (MBE), and (2) deposition of the entire III-nitride layered stacks and device structures by sputtering. Replacing conventional in situ GaN or AlN buffer layers with ex situ sputtered AlN buffers for MOCVD, HVPE, or MBE growth of III-nitride films on sapphire and silicon substrates results in the improved crystal quality through reduction in dislocation density and residual strain. Extensive efforts in the field of sputter deposition of III-nitrides resulted in crystalline quality of sputtered III-nitride films compatible with that of MOCVD and MBE grown layers despite the lower temperatures used in sputtering. For example, sputtering techniques made it possible to achieve GaN layers heavily doped with Si and Ge to electron concentrations in mid-1020 cm−3 range with mobilities exceeding 100 cm2 V−1 s−1, resulting in conductivities as high as those of benchmark transparent conducting oxides such as indium tin oxide (ITO). For moderate levels of doping with Si, mobilities comparable to state-of-the-art MOCVD-grown material have been demonstrated (up to ∼1000 cm2 V−1 s−1). The first promising results have been reported for devices (light emitters and field effect transistors) entirely produced by sputtering. (topical review)
Availability note (English)
Available from http://dx.doi.org/10.1088/1361-6641/ab3374Additional details
Identifiers
Publishing Information
- Journal Title
- Semiconductor Science and Technology
- Journal Volume
- 34
- Journal Issue
- 9
- Journal Page Range
- [23 p.]
- ISSN
- 0268-1242
- CODEN
- SSTEET
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 52039152
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; S71: CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS;
- Descriptors DEI
- ALUMINIUM NITRIDES; CHEMICAL VAPOR DEPOSITION; CONCENTRATION RATIO; DISLOCATIONS; DOPED MATERIALS; ELECTRONS; FIELD EFFECT TRANSISTORS; GALLIUM NITRIDES; HYDRIDES; INDIUM; MOLECULAR BEAM EPITAXY; ORGANOMETALLIC COMPOUNDS; SAPPHIRE; SEMICONDUCTOR MATERIALS; SILICON; SPUTTERING; SUBSTRATES; THIN FILMS; TIN OXIDES; VAPOR PHASE EPITAXY
- Descriptors DEC
- ALUMINIUM COMPOUNDS; CHALCOGENIDES; CHEMICAL COATING; CORUNDUM; CRYSTAL DEFECTS; CRYSTAL GROWTH METHODS; CRYSTAL STRUCTURE; DEPOSITION; DIMENSIONLESS NUMBERS; ELEMENTARY PARTICLES; ELEMENTS; EPITAXY; FERMIONS; FILMS; GALLIUM COMPOUNDS; HYDROGEN COMPOUNDS; LEPTONS; LINE DEFECTS; MATERIALS; METALS; MINERALS; NITRIDES; NITROGEN COMPOUNDS; ORGANIC COMPOUNDS; OXIDE MINERALS; OXIDES; OXYGEN COMPOUNDS; PNICTIDES; SEMICONDUCTOR DEVICES; SEMIMETALS; SURFACE COATING; TIN COMPOUNDS; TRANSISTORS