Low-temperature electrical resistivity of noble metals
Creators
- 1. Istituto di Fisica dell'Universita, Firenze 50125, Italy
Description
The low-temperature electrical resistivity of the noble metals silver and copper was studied. The Fermi surface of the noble metals is described by the simple eight-cone model and two-orthogonalized-plane-wave corrections were taken into account which are very important at the lowest temperatures. The use of the standard trial function in the variational formula for the resistivity makes the calculation more applicable to the temperature-dependent resistivity of impure samples. This interpretation is supported by comparison with the available experimental data. Results evidence the preponderance of the ''umklapp'' contribution to the low-temperature resistivity over the normal one. Moreover, they show that the resistivity as a function of temperature does not follow a well-defined power law, but, if one assumes the validity of a simple relation p approx. T/subn/, the exponent n varies continuously ranging from a value of nearly 6 to a value of nearly 4 in the region T = 1--15 K
Additional details
Identifiers
Publishing Information
- Journal Title
- Physical Review B
- Journal Volume
- 12
- Journal Issue
- 12
- Series
- Phys. Rev., B.
- Journal Page Range
- 5478-5487
- ISSN
- 0556-2805
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 7248113
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- COPPER; ELECTRIC CONDUCTIVITY; FERMI LEVEL; SILVER; TEMPERATURE DEPENDENCE; ULTRALOW TEMPERATURE; UMKLAPP PROCESSES; VERY LOW TEMPERATURE
- Descriptors DEC
- BASIC INTERACTIONS; ELECTRICAL PROPERTIES; ELECTROMAGNETIC INTERACTIONS; ELEMENTS; ENERGY LEVELS; INTERACTIONS; METALS; PHYSICAL PROPERTIES; TRANSITION ELEMENTS
Optional Information
- Notes
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