Published April 15, 2016 | Version v1
Journal article

Oxide reduction effects in SPS processing of Cu atomized powder containing oxide inclusions

  • 1. Lab. ICB, UMR 6303 CNRS/Université Bourgogne Franche-Comté, 9 Avenue Alain Savary - BP 47 870, 21078, DIJON Cedex (France)
  • 2. Lab. SIMAP, UMR 5266 CNRS/INP, 1130 rue de la Piscine - BP 75, 38402, ST MARTIN D'HERES Cedex (France)

Description

The SPS sintering of a commercial copper atomized powder was investigated for analyzing the effects of the oxides reduction reactions on densification and microstructure. This powder, with a mean particle size close to 12 μm, contains copper oxides (Cu2O mainly) located at the particle surface and inside the particles. Beforehand, the reduction of the oxides was studied by means of TGA, XPS analyses and pressureless sintering in atmosphere containing 4 percent of hydrogen. CuO and Cu2O were reduced at 280 and 425 °C respectively. The reduction of Cu2O located inside particles induced the swelling of these latter. The SPS sintering under vacuum did not allow removing the oxides, even using low heating rate during the cycle. Under hydrogen containing atmosphere, the oxide reduction is significant, but requires time, typically through low heating rates, to be efficient. Densification is not achieved in this case because of the development of pores related to the hydrogen sickness phenomenon. No particular effect is observed on neck formation and contacts strengthening. - Highlights: • Cu powders with internal oxides were sintered by SPS under vacuum and hydrogen atmosphere. • During sintering, densification is competing with particle swelling which may result from oxide reduction. • Despite the carbon matrix, oxides are not removed during SPS processing under vacuum. • Oxides can be reduced when hydrogen is used but this needs long processing times and induces porosity.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.matchemphys.2016.02.044

Additional details

Identifiers

DOI
10.1016/j.matchemphys.2016.02.044;
PII
S0254-0584(16)30114-6;

Publishing Information

Journal Title
Materials Chemistry and Physics
Journal Volume
173
Journal Page Range
p. 498-507
ISSN
0254-0584
CODEN
MCHPDR

Optional Information

Copyright
Copyright (c) 2016 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.