Published March 2006 | Version v1
Journal article

Influences of tensile strain and strain rate on the electron work function of metals and alloys

  • 1. Department of Mechanical Engineering, Changchun University, Changchun 130022 (China) and Department of Mechanical Engineering, University of Alberta, Edmonton, Alta., Canada T6G 2G8 (Canada)
  • 2. Department of Physics, P.O. Box 642814, Washington State University, Pullman, WA 99164-2814 (United States)
  • 3. School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150006 (China)
  • 4. College of Materials Science and Engineering, Nanling Campus, Jilin University, Changchun 130025 (China)

Description

The effect of deformation on the electronic work function (EWF) has been well documented and the dislocation mechanism responsible for the change in the EWF due to deformation has been postulated. This letter reports our recent experimental investigations on the change in the EWF of tensile specimens using a scanning Kelvin probe. It was demonstrated that both strain and strain rate can decrease the EWF, which is consistent with the previous experimental observations using different deformation conditions and which basically supports the postulation

Additional details

Identifiers

DOI
10.1016/j.scriptamat.2005.10.064;
PII
S1359-6462(05)00700-1;

Publishing Information

Journal Title
Scripta Materialia
Journal Volume
54
Journal Issue
5
Journal Page Range
p. 921-924
ISSN
1359-6462
CODEN
SCMAF7

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
38062091
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
ALLOYS; DEFORMATION; DENSITY; DISLOCATIONS; ELECTRONS; METALS; PROBES; STRAIN RATE; STRAINS; WORK FUNCTIONS
Descriptors DEC
CRYSTAL DEFECTS; CRYSTAL STRUCTURE; ELEMENTARY PARTICLES; ELEMENTS; FERMIONS; FUNCTIONS; LEPTONS; LINE DEFECTS; PHYSICAL PROPERTIES

Optional Information

Copyright
Copyright (c) 2005 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.