Published May 15, 2006 | Version v1
Journal article

Microstructural evolution during transient liquid phase bonding of Inconel 617 using Ni-Si-B filler metal

  • 1. McGill University, Department of Mining, Metals and Materials Engineering, 3610 University St., M.H. Wong Building, Montreal Que., H3A 2B2 (Canada)
  • 2. Aerospace Manufacturing Technology Center, National Research Council of Canada (Canada)

Description

The influence of process parameters on microstructural characteristics of transient liquid phase (TLP) bonded Inconel 617 alloy was investigated. Experiments were carried out at 1065 deg. C using nickel based filler metal (Ni-4.5% Si-3% B) with B as the melting point depressant (MPD) element. Two different thickness of interlayer and various holding times were employed. The influence of these processing parameters on the characteristics of the joint area particularly size, morphology and composition of precipitates was investigated. The presence of MoB, Mo2B, M23C6, TiC, M23(B, C)6 and Ni3B precipitates in the diffusion layer and Ni3B, Ni3Si and Ni5Si2 precipitates in the interlayer at the interface between the base metal and interlayer were demonstrated using electron back scattered diffraction (EBSD), energy dispersive spectrometry (EDS) and TEM

Additional details

Identifiers

DOI
10.1016/j.msea.2006.02.030;
PII
S0921-5093(06)00202-4;

Publishing Information

Journal Title
Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing
Journal Volume
423
Journal Issue
1-2
Journal Page Range
p. 269-281
ISSN
0921-5093
CODEN
MSAPE3

Optional Information

Copyright
Copyright (c) 2006 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.