Published October 30, 2014 | Version v1
Journal article

Lewis basicity, adhesion thermodynamic work and coordinating ability on aminated silicon surfaces

  • 1. Centro de Energía Química y Electroquímica (CELEQ), Universidad de Costa Rica, San José 2060 (Costa Rica)
  • 2. Escuela de Química, Universidad de Costa Rica, San José 2060 (Costa Rica)
  • 3. School of Chemistry and Biochemistry, Georgia Institute of Technology, Atlanta, GA 30332-0400 (United States)

Description

Highlights: • Silicon(1 0 0) surfaces with diamines followed by anchoring of copper complexes over the diamine layer, an approach that could be used for advanced functionalization of semiconducting surfaces. • Lewis basicity (using Fowkes–van Oss–Chaudhury–Good surface tension model) and adhesion thermodynamic work (using chemical force microscopy) were determined. • Higher basicity and thermodynamic work correlate with selective copper acetate monolayer grow. The cyclic voltammetry studies confirm the confined copper redox activity. - Abstract: Silicon(1 0 0) surfaces have been modified with three different amines (aniline, benzylamine and dodecylamine) and diamines (4-aminopyridine, 4-aminomethylpyridine, 1,12-dodecyldiamine). The surface energy was measured by contact angle technique. For Si-diamine surfaces, Lewis basicity (using Fowkes–van Oss–Chaudhury–Good surface tension model) and adhesion thermodynamic work (using chemical force microscopy) were determined. We related these data, the amine/diamine nature and their geometry on the surface (via DFT calculations) with the consequent ability to coordinate copper(II) acetate. Finally, copper(II) acetate monolayers behavior was studied by cyclic voltammetry

Availability note (English)

Available from http://dx.doi.org/10.1016/j.apsusc.2014.08.179

Additional details

Identifiers

DOI
10.1016/j.apsusc.2014.08.179;
PII
S0169-4332(14)01957-6;

Publishing Information

Journal Title
Applied Surface Science
Journal Volume
317
Journal Page Range
p. 1060-1067
ISSN
0169-4332
CODEN
ASUSEE

Optional Information

Copyright
Copyright (c) 2014 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.