Published September 1, 2001
| Version v1
Report
Alternate Electrolyte Composition for Electropolishing of Niobium Surfaces
Description
Electropolishing has shown promising results for the treatment of Nb cavities to be used in particle accelerators, particularly in the attainment of high surface electric fields. In support of the CEBAF Upgrade project and as part of a longer-term R and D program, we have investigated the properties of several electrolyte recipes. A particularly promising one consists of a mixture of lactic, sulfuric, and hydrofluoric acids. Initial tests reveal that smooth Nb surfaces can be achieved with no observable grain boundaries under optical microscope. We report on the results of the investigations of the parameters that control the polishing process using this particular acid mixture
Availability note (English)
Available from PURL: https://www.osti.gov/servlets/purl/792481-7lOupP/native/Additional details
Identifiers
Publishing Information
- Imprint Pagination
- 694 Kilobytes
- ISSN
- 0148-7191
- Report number
- JLAB-ACT--01-24
Conference
- Title
- 2001 SRF Workshop, KEK
- Dates
- 6-11 Sep 2001
- Place
- Tsukuba City (Japan)
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 33014321
- Subject category
- S36: MATERIALS SCIENCE;
- Resource subtype / Literary indicator
- Conference, Non-conventional Literature
- Descriptors DEI
- ACCELERATORS; CAVITIES; DEFECTS; ELECTROLYTES; ELECTROPOLISHING; GRAIN BOUNDARIES; HYDROFLUORIC ACID; LACTIC ACID; NIOBIUM; SULFURIC ACID
- Descriptors DEC
- CARBOXYLIC ACIDS; ELECTROLYSIS; ELEMENTS; FLUORINE COMPOUNDS; HALOGEN COMPOUNDS; HYDROGEN COMPOUNDS; HYDROXY ACIDS; INORGANIC ACIDS; INORGANIC COMPOUNDS; LYSIS; METALS; MICROSTRUCTURE; ORGANIC ACIDS; ORGANIC COMPOUNDS; OXYGEN COMPOUNDS; POLISHING; REFRACTORY METALS; SULFUR COMPOUNDS; SURFACE FINISHING; TRANSITION ELEMENTS
Optional Information
- Contract/Grant/Project number
- AC05-84ER40150
- Funding organization
- USDOE Office of Energy Research (ER) (United States)
- Secondary number(s)
- DOE/ER--40150-2023