Published March 1991
| Version v1
Journal article
PECVD SiO2 dielectric for niobium Josephson IC process
Creators
- 1. Tektronix, Inc., Beaverton, OR (United States)
- 2. California Univ., Berkeley, CA (United States). Dept. of Electrical Engineering and Computer Sciences
Description
PECVD SiO2 dielectric has been evaluated as an insulator for a Nb-based, all-refractory Josephson integrated circuit process. First, the properties of PECVD SiO2 films were measured and compared with those of evaporated SiO films. Second, the PECVD SiO2 dielectric film was used in our Nb-based Josephson integrated circuit process. The main problem was found to be the deterioration of the critical temperature of the superconducting niobium adjacent to the SiO2. The cause and a solution of the problem were investigated. Finally, a Josephson integrated sampler circuit was fabricated and tested. This paper shows acceptable junction I-V characteristics and a measured time resolution of a 4.9 ps pulse in liquid helium
Additional details
Publishing Information
- Journal Title
- IEEE Transactions on Magnetics
- Journal Volume
- 27
- Journal Issue
- 2
- Series
- IEEE Trans. Magn.
- Journal Page Range
- 3129-3132
- ISSN
- 0018-9464
- CODEN
- IEMGA
Conference
- Title
- 1990 applied superconductivity conference.
- Dates
- 24-28 Sep 1990.
- Place
- Snowmass, CO (United States).
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 23020979
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- CHEMICAL VAPOR DEPOSITION; CRITICAL TEMPERATURE; DIELECTRIC MATERIALS; FABRICATION; HELIUM; INTEGRATED CIRCUITS; JOSEPHSON JUNCTIONS; NIOBIUM; SILICON OXIDES; SUPERCONDUCTIVITY; TIME RESOLUTION
- Descriptors DEC
- CHALCOGENIDES; CHEMICAL COATING; DEPOSITION; ELECTRIC CONDUCTIVITY; ELECTRICAL PROPERTIES; ELECTRONIC CIRCUITS; ELEMENTS; MATERIALS; METALS; NONMETALS; OXIDES; OXYGEN COMPOUNDS; PHYSICAL PROPERTIES; RARE GASES; RESOLUTION; SEMICONDUCTOR JUNCTIONS; SILICON COMPOUNDS; SURFACE COATING; THERMODYNAMIC PROPERTIES; TIMING PROPERTIES; TRANSITION ELEMENTS; TRANSITION TEMPERATURE
Optional Information
- Secondary number(s)
- CONF-900944--.