Published May 1996
| Version v1
Journal article
Thermal expansion of YbCu4Ag and YbCu4Au
- 1. Technische Univ., Vienna (Austria). Inst. fuer Experimentalphysik
- 2. Kumamoto Univ. (Japan). Dept. of Physics
Description
Thermal expansion ΔL/L was measured on the isostructural compounds YbCu4Ag and YbCu4Au. It was found that for YbCu4Ag the thermal expansion coefficient α(T) exhibits a pronounced negative minimum around 25 K. In contrast, α(T) of YbCu4Au is positive and increases at low temperatures. (orig.)
Additional details
Publishing Information
- Journal Title
- Journal of Magnetism and Magnetic Materials
- Journal Volume
- 157-158
- Journal Page Range
- p. 679-680.
- ISSN
- 0304-8853
- CODEN
- JMMMDC
Conference
- Title
- 6. European magnetic materials and applications conference (EMMA-6).
- Dates
- 4-8 Sep 1995.
- Place
- Vienna (Austria).
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- Netherlands
- INIS RN
- 28012079
- Subject category
- S36: MATERIALS SCIENCE;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- COPPER ALLOYS; CRYSTAL STRUCTURE; ELECTRIC CONDUCTIVITY; GOLD ALLOYS; INTERMETALLIC COMPOUNDS; KONDO EFFECT; LATTICE PARAMETERS; SILVER ALLOYS; TEMPERATURE DEPENDENCE; TEMPERATURE RANGE 0000-0013 K; TEMPERATURE RANGE 0013-0065 K; TEMPERATURE RANGE 0065-0273 K; THERMAL EXPANSION; X-RAY DIFFRACTION; YTTERBIUM ALLOYS
- Descriptors DEC
- ALLOYS; COHERENT SCATTERING; DIFFRACTION; ELECTRICAL PROPERTIES; EXPANSION; PHYSICAL PROPERTIES; RARE EARTH ALLOYS; SCATTERING; TEMPERATURE RANGE; TRANSITION ELEMENT ALLOYS