Effect of Hot Pressure Parameters on W-SiC/Cu Composites Densification

In the paper, 30W-30SiC/40wt.%Cu composites were fabricated by tape casting and hot-pressing sintering. Microstructures of the W-SiC/Cu green tape and the green tape after organic additives removal were studied. The results showed that W, Cu and SiC particles exhibited a uniform distribution. The effects of sintering temperature, sintering pressure and holding time on the microstructures, porosity, and density of the W-SiC/Cu composites were investigated. The results showed the porosity of the W-SiC/Cu composites decreased and the density increased with the increasing of the sintering temperature, sintering pressure and holding time. The porosity and density of the W-SiC/Cu composite prepared at the condition of 900 °C- 200 MPa- 2 h achieved 0.52 % and 9.84 g/cm³. (paper)